Kelington Group Bhd has secured its largest project to date, valued at a provisional US$452 million (approximately RM1.83 billion), to provide turnkey total facility tool hookup services for a semiconductor wafer fabrication facility in Gujarat, India. The company’s subsidiary, Kelington Engineering (S) Pte Ltd, has accepted the letter of award and will act as the main contractor for the undertaking.
The contract encompasses the complete design, installation, connection, testing, and handover of manufacturing, laboratory, and support tools, along with related tool-specific support systems for two facility modules. The project will cover Modules 1 and 2, with the provisional contract divided into US$249.9 million for Module 1 and US$202 million for Module 2. In total, the scope includes handling up to 886 tools, although the final contract value will be adjusted based on the actual quantities of tools and services delivered.
The expected completion timeframe for the works is 30 months, with a target finish set for February 2029. Kelington’s Chief Executive Officer, Lim Seng Chuan, described the award as a significant milestone, highlighting that it is the largest project the company has secured since its establishment. He emphasized that the contract not only reflects confidence in Kelington’s capabilities, technology, and execution record but also enhances the company's contracting and management roles as a main contractor specializing in semiconductor turnkey total facility tool hookup services.
This project follows an earlier contract from the same client for a different scope of work, indicating a continuing business relationship between Kelington Group and the semiconductor facility owner. The latest award marks a notable expansion of Kelington’s involvement in the semiconductor industry, as it seeks to leverage its expertise in engineering solutions for wafer fabrication facilities.